"Die & Mould Technology" is a journal sponsored by the China Ministry of Education and presided by Shanghai Jiao Tong University, and was founded in 1983. The journal is publicly distributed domestic and abroad and served as a statistical source journals of Chinese Scientific and Technological Papers. Nowadays, the journal is published bimonthly, reporting mainly on the research of die & mould and material processing technology. The journal also shines lights on the development trend of the industry. Its general purpose is to promote academic and technology exchanges, active innovative ideas, lead technology development, and serve engineering applications in the field of die & mould and material processing. The main columns are: New Technologies and New Theories, Die & Mould Design, Forming Process, CAD/CAE/CAM, Mould Manufacturing, Materials Heat Treatment, and Industry Trends. In the past 30 years, the journal insists on the publication philosophy and pursues a high level academic standard. Its editing and publishing quality has been continuously improved. In 2019, it won the awards of Excellent Editing in Shanghai magazine quality inspection. Nowadays, it has been recognized and favored in the field of die & mould and material processing, and its circulation is among the best academic and technology journals presided by Shanghai Jiao Tong University.
The editorial board of the journal will adhere to the philosophy of "Academic Leading, Technology Innovation, Engineering Services", strengthen the journal’s subjectivity in the academy and technology, and serve wholeheartedly for the innovation and development of the industry. The journal expects to become a unique technical garden in the field of die & mould and material processing, by continuously attracting the attention and support of peers in the industry and getting more contributive papers.
In order to adapt to China's information construction and expand the exchange channels of knowledge and information between the journal and authors, the journal has joined the Chinese Academic Journals Online Publishing Database, CNKI Series Database, China Journal Network, Digital Journal Group of Wanfang Data Resources System, etc. If the author does not agree with the article being included, we will specially treat your paper upon your declaration when submitting your manuscript.
Editorial Committee of "Mould Technology"
Honorary Editor: RUAN Xueyu
Editor-in-chief: CUI Zhenshan Deputy editor: DONG Xianghuai ZHANG Weiying
Editorial Committee: (in accordance with the strokes of surname)
WAN Min WANG Yihua WANG Baoyu WANG Minjie FANG Yongjie HUA Lin
LIU Depu YANG Chunqi LI Mingzhe LI Jianjun LI Shuhui YANG He
ZHOU Jie ZHOU Xionghui SHAN Zhongde ZHAO Shengdong ZHAO Jun ZHAO Guoqun
WU Guofeng XIN Yong ZHANG Shihong WU Bingshu YUAN Shijian LIN Jianping
ZHAO Zude ZHONG Zhiping HOU Hongliang YAO Xiaochun XIA Hanguan XIA Qinxiang
CUI Zhenshan
ZHOU Jie ZHOU Xionghui SHAN Zhongde ZHAO Shengdong ZHAO Jun ZHAO Guoqun
WU Guofeng XIN Yong ZHANG Shihong WU Bingshu YUAN Shijian LIN Jianping
ZHAO Zude ZHONG Zhiping HOU Hongliang YAO Xiaochun XIA Hanguan XIA Qinxiang
CUI Zhenshan
Contact details
Editorial Office Address: 1954 Huashan Road, Shanghai, China
Phone: 021-62812525, 62813430-8310
Fax: 021-62830749
E-mail: mjjs@ sjtu.edu.cn